The Products

We deal in production of Single sided and Double sided PTH PCBs and also high frequency PCBs used in

• Microwave Applications
• Microwave Integrated Circuits (MICs)
• Chemical Milling Facility.

TECHNICAL SPECIFICATIONS

Types of PCBs	: Single sided / Double sided
Capacity	: 10000 Square Meters / Annum    MICS : 200 Square Meters / Annum
Production Process	: Substactive
Maximum Layer Count	: 2 Layers
Standard Thickness of PCBs	: 0.2 mm to 3.2 mm
Input Data Medal	: Films, Gerber Data
Base Laminate	: FR-4 Glass Epoxy   CEM   Teflon based RTD Laminates and   Allumina hard substrates
Base Copper	: 17.5, 35 and 70 micron

REGISTRATION TOLERANCES

Drill Position	: +/- 0.01 mm
Pad Position	: +/- 0.02 mm
Photo Location	: +/- 0.08 mm
Electrical Testing Both sided	:
SMT's UP to Quarter Grid Pitch	: 0.65 mm
Type of Protective Finish	: Solder Resist Heat Cured Peelable Solde Mask
Surface Finish	: Copper   Solder Levelling   Gold 0.5 Mircon Flash on SMD Portion   Nickel 5-8 Microns   Gold 1.5-2 Microns
Copper Thickness	: 17.5 & 35 Micron

MAXIMUM PANEL SIZE

Single / Double sided PCB (General)	: 600 x 400 mm
Larger Size	: 400 mm x 1 Mtr. (at present)
Copper Thickness	: 17.5 & 35 Micron

MINIMUM PANEL SIZE

Single / Double sided	: 10 mm x 10 mm
Min. Hole Diameter (PTH)	: 0.30 mm
Min. Annual Ring	: 0.10 mm
Min. Conductor Width	: 0.10 mm
Min. Conductor Spacing	: 0.15 mm
Drilled Hole Position Tolerance	: +/- 0.05 mm
Hole Dia. Tolerance	: As per standards

PLATING THICKNESS

Gold	: 1.5 microns to 3 microns
Copper (PTH)	: 25 microns to 40 microns
Nickel	: 5 microns to 8 microns

APPROVALS

CACT from Bharat Sanchar Nigam Limited LCSO Approval from Govt. of India, Ministry of Defence ISO 9002-2000 is under process

PHOTOLITHOGRAPHIC FABRICATION OF MICROWAVE INTEGRATED CIRCUITS (MICs)
Standard Photolithography Techniques are used for the fabrication of the Microwave Integrated Circuits (MICs). These afford high accuracy in the line definition, resolution and reproducibility in the fabrication. The process document is aimed at presenting the relevant information in as much detail and thought as possible in order to serve as a ready source of information for those who are not fully familiar with these techniques.

In the fabrication of PCBs (Printed Circuit Boards) the minimum line width encountered is in the range of 200-250 microns. In MICs the maximum line width is of the order of 150 microns. We can say where PCBs ends MICs starts. Even dust particle size will be comparable to that of the line widths and spaces encountered in MICs. So work cultures are different for processing of PCBs and MICs even though Photolithography processing Technique is common for both. Hence clean environment is a must for MIC processing.

RELIASABLE CAPABILITIES

MATERIAL	SOFT SUBSTRATE	HARD SUBSTRATE
	Teflon Base Copper Claded	Alumina Hard Substrate
Delectric Thickness	1 mil to 62 mil	15 & 25 mil
Substrate Size	1" x 1" to 15" x 40"	1" x 1", 1" x 2", 2" x 2"
Metalisation	1/2 oz, 1 oz, Copper	Chromium : 100 to 200 A
		Tanlum Nitride
		Titanium Tungston : 300A
		Gold : 200 micro inch
Min. Line Width & Gap	80 microns	20 microns
Tolerance	+/- microns	+/- 2 microns
Double side Allignment
Accuracy	Better than 20 microns	-----------
D	D	D